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3D image sensor SiP with TSV silicon interposer

  • Published:2009-05 Issue: Volume: Page:
  • ISSN:
  • Container-title:2009 59th Electronic Components and Technology Conference
  • language:
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Author:

Limansyah I.1,Wolf M. J.2,Klumpp A.3,Zoschke K.2,Wieland R.3,Klein M.2,Oppermann H.2,Nebrich L.3,Heinig A.4,Pechlaner A.1,Reichl H2,Weber W.1

Affiliation:

1. Infineon Technologies, Munich, Germany

2. Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin, Germany

3. Fraunhofer Institute for Reliability and Microintegration (IZM), Munich, Germany

4. Fraunhofer Institute for Integrated Circuits (IIS) Design Automation Division, Dresden, Germany

Publisher

IEEE

Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Investigation of an Embedded Cooling RF Silicon Interposer for an Ultrahigh Heat Flux GaN TR Array;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-02

2. Fabrication and RF Property Evaluation of High-Resistivity Si Interposer for 2.5-D/3-D Heterogeneous Integration of RF Devices;IEEE Transactions on Components, Packaging and Manufacturing Technology;2018-11

3. System in package (SiP) technology: fundamentals, design and applications;Microelectronics International;2018-10-01

4. Möglichkeiten und Herausforderungen moderner 3D-Systeme;Entwurf integrierter 3D-Systeme der Elektronik;2012

5. Electronic Design Automation for Implementation of 3D Integrated Systems;Microelectronic Systems;2011
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