Novel Vertical Channel-All-Around(CAA) IGZO FETs for $2\mathrm{T}0\mathrm{C}$ DRAM with High Density beyond 4F2 by Monolithic Stacking
Author:
Affiliation:
1. Institute of Microelectronics of the Chinese Academy of Sciences,Key Laboratory of Microelectronics Devices and Integrated Technology,Beijing,China
2. Huawei Technologies Co., LTD.
Funder
National Natural Science Foundation of China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9720433/9720494/09720682.pdf?arnumber=9720682
Reference5 articles.
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2. 3D-Stacked 2T0C-DRAM Cells Using Al2O3/TiO2-Based 2DEG FETs;IEEE Electron Device Letters;2024-07
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