Challenges in Radio Frequency and Mixed-Signal Circuit Reliability-Reference-Cited by-同舟云学术

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Challenges in Radio Frequency and Mixed-Signal Circuit Reliability

Published:2019-12 Issue: Volume: Page:
ISSN:
Container-title:2019 IEEE International Electron Devices Meeting (IEDM)
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Author:

Reddy V.,Martin S.,Benaissa K.,Chancellor C.,Bhatia K.,Srinivasan V.,Rentala V.,Krishnan S.,Ondrusek J.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8971803/8993428/08993668.pdf?arnumber=8993668

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Single Power Supply, Compact, Self-Adaptive Dynamic Range Lock-In Amplifiers;Electronics;2023-11-03

2. Temperature-Dependent Study of Large-Signal Reliability of p-FET-Based Power Amplifier for mmWave Applications;IEEE Transactions on Device and Materials Reliability;2023-09

3. Impact of RF Frequency Bands on the DC and Large Signal Reliability of a 45nm RFSOI NFET based Power Amplifier Cell;2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM);2023-03-07

4. Investigation of Temperature Dependence of mmWave Power Amplifier Large-Signal Reliability Performance;IEEE Transactions on Electron Devices;2023-03

5. Reliability of SPST Series-stacked SOI CMOS RF Switches for mmWave Applications;2023 IEEE International Reliability Physics Symposium (IRPS);2023-03

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