Author:
Hopper A.,Jones A.,Augur R.A.,Fice M.J.,Blythe S.,Ahmed H.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,General Engineering,Electronic, Optical and Magnetic Materials
Cited by
6 articles.
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1. A survey of test techniques for MCM substrates;Journal of Electronic Testing;1997
2. A novel test technique for MCM substrates;IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B;1997
3. A Survey of Test Techniques for MCM Substrates;Frontiers in Electronic Testing;1997
4. Package Electrical Testing;Microelectronics Packaging Handbook;1997
5. Boundary-Scan Testing for Mixed — Signal MCMs;VLSI: Integrated Systems on Silicon;1997