A novel test technique for MCM substrates-Reference-Cited by-同舟云学术

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A novel test technique for MCM substrates

Published:1997 Issue:1 Volume:20 Page:2-12
ISSN:1070-9894
Container-title:IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
language:
Short-container-title:IEEE Trans. Comp., Packag., Manufact. Technol. B

Author:

Kim B.,Swaminathan M.,Chatterjee A.,Schimmel D.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Engineering

Link

http://xplorestaging.ieee.org/ielx4/96/12076/00554413.pdf?arnumber=554413

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