Low-Temperature Bonding of PZT (PbZrTiO3) and Flexible Printed Circuits Using Sn52In Solder Anisotropic Conductive Films for Flexible Ultrasonic Transducers-Reference-Cited by-同舟云学术

Low-Temperature Bonding of PZT (PbZrTiO3) and Flexible Printed Circuits Using Sn52In Solder Anisotropic Conductive Films for Flexible Ultrasonic Transducers

Published:2019-11 Issue:11 Volume:9 Page:2152-2159
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Park Jae-Hyeong^ORCID,Park Jong Cheol,Shin SangMyung,Paik Kyung-Wook^ORCID

Funder

Nano Open Innovation Lab Project from National NanoFab Center (NNFC) and the Ministry of Science and ICT

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/8894901/08854179.pdf?arnumber=8854179

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