Affiliation:
1. Department of Electrical Engineering, Pohang University of Science and Technology, Pohang, South Korea
2. Department of Electrical Engineering and the Department of Convergence IT Engineering, Pohang University of Science and Technology, Pohang, South Korea
Funder
Commercializations Promotion Agency for R&D Outcomes
Korea government
Institute of Information & Communications Technology Planning & Evaluation
Korea Government (MSIT), A Development of Intelligent PHY Interface for High-Speed PIM Data Transfer
MSIT, Korea, under the ITRC (Information Technology Research Center) support program
IITP
BK21 FOUR Project of NRF for the Department of Electrical Engineering, POSTECH
design and application of next generation nonvolatile memory hierarchy Cluster Academia Collaboration Program
Samsung Electronics Co., Ltd
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Signal Integrity Analysis and Design for Cascaded Wire Bonding of Low-Power Double Data Rate (LPDDR);2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa);2024-05-20
2. Signal Integrity Analysis of Wire Bonding Finger Capacitance to Reduce the Reflection of Multi-drop Topology for Low-Power Double Data Rate (LPDDR);2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI);2023-07-29