Experimental Study of a Two-Phase Immersion Cooling System for the CPU in a PC and a 2U Server Operated at the Overclocking Frequency
Author:
Affiliation:
1. Department of Energy and Refrigerating Air-Conditioning Engineering, National Taipei University of Technology, Taipei, Taiwan
2. VICI Holdings, Taipei, Taiwan
Funder
Industrial Cooperation Project between the National Taipei University of Technology (NTUT) and VICI Holdings
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/5503870/10195990/10160014.pdf?arnumber=10160014
Reference25 articles.
1. Cooling of server electronics: A design review of existing technology
2. Enhanced heat transfer of heat sink channels with micro pin fin roughened walls
3. Integrated Silicon Microfluidic Cooling of a High-Power Overclocked CPU for Efficient Thermal Management
4. Thermal Analysis of Cold Plate for Direct Liquid Cooling of High Performance Servers
5. High-performance heat sinking for VLSI
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1. Experimental and numerical study of structural parameters on the heat transfer performance of submerged cooling system;Applied Thermal Engineering;2024-11
2. Two-Phase Immersion Cooling of Simulated Server Chips Using HFE-7100;2024 5th International Conference on Computer Engineering and Application (ICCEA);2024-04-12
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