Cooling of server electronics: A design review of existing technology-Reference-Cited by-同舟云学术

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Cooling of server electronics: A design review of existing technology

Published:2016-07 Issue: Volume:105 Page:622-638
ISSN:1359-4311
Container-title:Applied Thermal Engineering
language:en
Short-container-title:Applied Thermal Engineering

Author:

Kheirabadi Ali C.,Groulx Dominic

Funder

Natural Sciences and Engineering Research Council of Canada

Canada Foundation for Innovation

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference145 articles.

1. Thermal management challenges in telecommunication systems and data centers;Garimella;IEEE Trans. Compon. Packag. Manuf. Technol.,2012

2. Technological drivers in data centers and telecom systems: multiscale thermal, electrical, and energy management;Garimella;Appl. Energy,2013

3. Data Center Efficiency Assessment;Whitney,2014

4. Data center evolution;Kant;Comput. Netw.,2009

5. A review of data center cooling technology, operating conditions and the corresponding low-grade waste heat recovery opportunities;Ebrahimi;Renew. Sustain. Energy Rev.,2014

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