Residue-Assisted Water Layer Build-Up Under Transient Climatic Conditions and Failure Occurrences in Electronics-Reference-Cited by-同舟云学术

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Residue-Assisted Water Layer Build-Up Under Transient Climatic Conditions and Failure Occurrences in Electronics

Published:2020-10 Issue:10 Volume:10 Page:1617-1635
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Piotrowska Kamila^ORCID,Ambat Rajan

Funder

CELCORR/CreCon Consortium

Innovation Fund Denmark through the IN SPE Project

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/9212670/09129872.pdf?arnumber=9129872

Cited by 18 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. “No-Clean” Flux Residues Detection With Impedance Measurements;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-04

2. Polyalphaolefin Oil/MgO-20 Nanofluids Coating Shows Corrosion Resistance, High Moisture Resistance, and Water Resistance for Electrical and Electronic Equipment;Coatings;2023-09-10

3. Probability of Failure due to Electrochemical Migration on Surface Mount Capacitor under Electrolyte Condition with same Contamination and Conductivity Level;2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac);2023-06-12

4. Effect of flux activator in reflow process related flux residue on the climatic reliability of surface-mount electronic devices;Journal of Materials Science: Materials in Electronics;2023-06

5. Review—Electrochemical Migration in Electronic Materials: Factors Affecting the Mechanism and Recent Strategies for Inhibition;Journal of The Electrochemical Society;2023-02-01

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