Design and Implementation of a Compact 3-D Stacked RF Front-End Module for Micro Base Station

Author:

Tian GengxinORCID,Li Jun,Hou FengzeORCID,Zhang Wenwen,Guo Xueping,Cao Liqiang,Wan Lixi

Funder

National Key Basic Research Development Program of China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

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4. A L-Band High Gain Amplifier Module Using 3D SiP Technology;2023 6th International Conference on Electronics Technology (ICET);2023-05-12

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