Development of a Novel Compliant-Bump Structure for ACA-Bonded Chip-on-Flex (COF) Interconnects With Ultra-Fine Pitch-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Development of a Novel Compliant-Bump Structure for ACA-Bonded Chip-on-Flex (COF) Interconnects With Ultra-Fine Pitch

Published:2011-01 Issue:1 Volume:1 Page:33-42
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Lu Su-Tsai,Lin Yu-Min,Chuang Chun-Chih,Chen Tai-Hong,Chen Wen-Hwa

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/5503870/5738414/05674111.pdf?arnumber=5674111

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The role of a nonconductive film (NCF) on Cu/Ni/Sn-Ag microbump interconnect reliability;Journal of Materials Science: Materials in Electronics;2020-08-11

2. Nanowire ACF for Ultrafine-Pitch Flip-Chip Interconnection;Nanopackaging;2018

3. Analytical investigation on thermal-induced warpage behavior of ultrathin chip-on-flex (UTCOF) assembly;Science China Technological Sciences;2016-10-17

4. Experimental Method and Finite-Element Simulation Model for Investigation Into Flip-Chip-on-Film Inner Lead Bonding Parameters;IEEE Transactions on Device and Materials Reliability;2016-06

5. Low temperature chip on film bonding technology for 20 µm pitch applications;Journal of Materials Science: Materials in Electronics;2015-12-14

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP