Author:
Chen JianKui,Xu ZhouLong,Huang YongAn,Duan YongQing,Yin ZhouPing
Publisher
Springer Science and Business Media LLC
Subject
General Engineering,General Materials Science
Cited by
5 articles.
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1. Vacuum-Based Picking-up and Placing-on;Modeling and Application of Flexible Electronics Packaging;2019
2. Advanced Electronic Packaging;Modeling and Application of Flexible Electronics Packaging;2019
3. Interfacial Modeling of Flexible Multilayer Structures;Modeling and Application of Flexible Electronics Packaging;2019
4. Polymer elastic bump formation through photodefinable thermal reflow process for system in foil package;Journal of Micromechanics and Microengineering;2018-09-07
5. Defect inspection of flip chip package using SAM technology and fuzzy C-means algorithm;Science China Technological Sciences;2018-02-01