An Artificial Intelligence-Based Pick-and-Place Process Control for Quality Enhancement in Surface Mount Technology-Reference-Cited by-同舟云学术

An Artificial Intelligence-Based Pick-and-Place Process Control for Quality Enhancement in Surface Mount Technology

Published:2022-10 Issue:10 Volume:12 Page:1702-1711
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

He Jingxi¹^ORCID,Cen Yuqiao²,Alelaumi Shrouq³^ORCID,Won Daehan⁴^ORCID

Affiliation:

1. Modeling Software and Analytics, Corning Incorporated, Corning, NY, USA

2. Systems Science and Industrial Engineering, Binghamton University, Binghamton, NY, USA

3. Manufacturing and Operations Engineering, Apple Inc., Cupertino, CA, USA

4. Systems Science and Industrial Engineering, State University of New York at Binghamton, Binghamton, NY, USA

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

Reference32 articles.

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