Thermal Analysis of High-Power Integrated Circuits and Packages Using Nonconformal Domain Decomposition Method-Reference-Cited by-同舟云学术

Thermal Analysis of High-Power Integrated Circuits and Packages Using Nonconformal Domain Decomposition Method

Published:2013-08 Issue:8 Volume:3 Page:1321-1331
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Shao Yang,Peng Zhen,Lee Jin-Fa

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

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