The Domain Decomposition Method With Adaptive Time Step for the Transient Thermal Analysis of 3-D ICs-Reference-Cited by-同舟云学术

The Domain Decomposition Method With Adaptive Time Step for the Transient Thermal Analysis of 3-D ICs

Published:2023 Issue: Volume:11 Page:48069-48079
ISSN:2169-3536
Container-title:IEEE Access
language:
Short-container-title:IEEE Access

Author:

Liu Na¹^ORCID,Wang Chenyang²,Xi Chen¹,Wu Qiuyue¹,Liu Qiqiang¹,Zhuang Mingwei¹^ORCID,Shi Linlin³,Liu Qing Huo²^ORCID

Affiliation:

1. Fujian Provincial Key Laboratory of Electromagnetic Wave Science and Detection Technology, Institute of Electromagnetics and Acoustics, Xiamen University, Xiamen, China

2. Department of Electrical and Computer Engineering, Duke University, Durham, NC, USA

3. Fifth Electronics Research Institute of Ministry of Industry and Information Technology, Guangzhou, China

Funder

National Natural Science Foundation of China

Opening Project of Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Engineering,General Materials Science,General Computer Science,Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/6287639/10005208/10032319.pdf?arnumber=10032319

Reference45 articles.

1. Thermal Accumulation Effects on the Transient Temperature Responses in LDMOSFETs Under the Impact of a Periodic Electromagnetic Pulse

2. A discontinuous Galerkin finite element method for heat conduction problems with local high gradient and thermal contact resistance;liu;Comput Model Eng Sci,2009

3. Accurate and Fast Thermal Analysis of Multistage Depressed Collectors for Traveling-Wave Tubes Using Finite-Element Method

4. Electrothermal Cosimulation of 3-D Carbon-Based Heterogeneous Interconnects

5. Transient Electromagnetic-Thermal Simulation of Dispersive Media Using DGTD Method

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electrothermal Transient Co-Simulation With Domain Decomposition Method for 3-D Complex Integrated Systems;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-08

2. Capped MIM metamaterial for ultra-broadband perfect absorbing and its application in radiative cooling;Applied Optics;2023-07-12