LB-ADI: An Efficient Method for Transient Thermal Simulation of Integrated Chiplets and Packages-Reference-Cited by-同舟云学术

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LB-ADI: An Efficient Method for Transient Thermal Simulation of Integrated Chiplets and Packages

Published:2024 Issue: Volume:9 Page:149-156
ISSN:2379-8815
Container-title:IEEE Journal on Multiscale and Multiphysics Computational Techniques
language:
Short-container-title:IEEE J. Multiscale Multiphys. Comput. Tech.

Author:

Li Jie¹^ORCID,Tang Min¹^ORCID,Wu Lin-Sheng¹^ORCID,Jiang Liguo²^ORCID,Dai Wenliang²^ORCID,Mao Junfa¹^ORCID

Affiliation:

1. State Key Laboratory of Radio Frequency Heterogeneous Integration, Shanghai Jiao Tong University, Shanghai, China

2. Xpeedic Technology, Company Ltd, Shanghai, China

Funder

National Key R&D Program of China

National Natural Science Foundation of China

Science and Technology Commission of Shanghai Municipality

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx7/7274859/10296074/10495138.pdf?arnumber=10495138

Reference21 articles.

1. Chiplet Heterogeneous Integration Technology—Status and Challenges

2. Architecture, Chip, and Package Codesign Flow for Interposer-Based 2.5-D Chiplet Integration Enabling Heterogeneous IP Reuse

3. IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management

4. Thermal Modeling of a Chiplet-Based Packaging With a 2.5-D Through-Silicon Via Interposer

5. Transient Electrical-Thermal Analysis of 3-D Power Distribution Network With FETI-Enabled Parallel Computing

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