Evaluation of Aerosol Jet Printing (AJP) technology for electronic packaging and interconnect technique-Reference-Cited by-同舟云学术

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Evaluation of Aerosol Jet Printing (AJP) technology for electronic packaging and interconnect technique

Published:2012-09 Issue: Volume: Page:
ISSN:
Container-title:2012 4th Electronic System-Integration Technology Conference
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Author:

Stoukatch S.,Laurent P.,Dricot S.,Axisa F.,Seronveaux L.,Vandormael D.,Beeckman E.,Heusdens B.,Destine J.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/6478870/6522698/06542067.pdf?arnumber=6542067

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Realization of Circuits with Additively Printed Water Based Nanoparticle Sustainable Silver-Ink with Ultrasonic Atomization on Aerosol Jet Printer;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30

2. Hybrid Printing of Silver-Based Inks for Application in Flexible Printed Sensors;Crystals;2023-04-24

3. Highly conductive electronics circuits from aerosol jet printed silver inks;Scientific Reports;2021-09-13

4. Eco-Friendly Lead-Free Solder Paste Printing via Laser-Induced Forward Transfer for the Assembly of Ultra-Fine Pitch Electronic Components;Materials;2021-06-17

5. Printed, Wireless, Soft Bioelectronics and Deep Learning Algorithm for Smart Human–Machine Interfaces;ACS Applied Materials & Interfaces;2020-10-21

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