Realization of Circuits with Additively Printed Water Based Nanoparticle Sustainable Silver-Ink with Ultrasonic Atomization on Aerosol Jet Printer
Author:
Affiliation:
1. Auburn University, NSF-CAVE3 Electronics Research Center,Department of Mechanical Engineering,Auburn,AL,36849
2. NextFlex Manufacturing Institute,San Jose,CA,95131
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10177286/10177494/10177662.pdf?arnumber=10177662
Reference16 articles.
1. Process Recipes for Additively Printed Copper-Ink Flexible Circuits using Direct Write Methods
2. Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10Hours;lall;Proceedings of the ASME,0
3. Process Development for Additive Fabrication of Z-Axis Interconnects In Multilayer Circuits
4. Process Development for Printing Copper Conductible Ink on Flexible Substrates using Aerosol Jet Printing Technology
5. Toward Defect-Free Additive Fabricating of Flexible and Hybrid Electronics: Physics-Based Computational Modeling and Control of Aerosol Jet Printing
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1. Comparison of Sustainable and Non-Sustainable Ink Process-Performance Interactions for Additively Printed Circuits;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
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