Laser Assisted Bonding Technology Enabling Fine Bump Pitch in Flip Chip Package Assembly-Reference-Cited by-同舟云学术

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Laser Assisted Bonding Technology Enabling Fine Bump Pitch in Flip Chip Package Assembly

Published:2018-09 Issue: Volume: Page:
ISSN:
Container-title:2018 7th Electronic System-Integration Technology Conference (ESTC)
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Author:

Chen Chi-Yuan,Hsu Ian,Lin Stanley,Park DongSam,Hsieh Ming-Che

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8520538/8546331/08546345.pdf?arnumber=8546345

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Q-time Assessment on Electroplated Nickel/Gold Interface Quality;2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC);2024-05-13

2. Reconfigurable Vacuum Sample Holder for Through-Silicon Microscopy and Laser-Assisted Bonding;IEEE Photonics Journal;2023-10

3. Advanced Flip Chip Packaging;Springer Series in Reliability Engineering;2023

4. Machine Vision System Utilizing Black Silicon CMOS Camera for Through-Silicon Alignment;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-12

5. Development and optimization of the laser-assisted bonding process for a flip chip package;Microsystem Technologies;2019-09-16

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