Machine Vision System Utilizing Black Silicon CMOS Camera for Through-Silicon Alignment-Reference-Cited by-同舟云学术

Machine Vision System Utilizing Black Silicon CMOS Camera for Through-Silicon Alignment

Published:2022-12 Issue:12 Volume:12 Page:2019-2026
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Vlasov Aleksandr Andreevich¹^ORCID,Aydin Alp Eren¹,Uusitalo Topi¹,Viheriala Jukka¹^ORCID,Guina Mircea¹^ORCID

Affiliation:

1. Optoelectronics Research Centre, Physics Unit, Tampere University, Tampere, Finland

Funder

Business Finland through project PICAP

Academy of Finland through Photonics Flagship Program PREIN

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

Reference39 articles.

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