Reconfigurable Vacuum Sample Holder for Through-Silicon Microscopy and Laser-Assisted Bonding
Author:
Affiliation:
1. Optoelectronics Research Centre, Physics Unit, Tampere University, Tampere, Finland
Funder
Business Finland through Project Photonic Integrated Circuits for Industrial Applications
Academy of Finland through Photonics Flagship Program Photonics Research and Innovation
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Atomic and Molecular Physics, and Optics
Link
http://xplorestaging.ieee.org/ielx7/4563994/10225446/10210034.pdf?arnumber=10210034
Reference60 articles.
1. Microjoining of dissimilar materials for optoelectronic and biomedical applications
2. A Wafer-Level Packaging Approach for MEMS and Related Microsystems using Selective Laser-Assisted Bonding (LAB)
3. GaSb diode lasers tunable around 2.6 μm using silicon photonics resonators or external diffractive gratings
4. Attachment of optoelectronic components to silicon submounts by Nd:YAG laser soldering of indium
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