Multi-Chip Patch in Low Stress Polymer Foils based on an Adaptive Layout for Flexible Sensor Systems-Reference-Cited by-同舟云学术

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Multi-Chip Patch in Low Stress Polymer Foils based on an Adaptive Layout for Flexible Sensor Systems

Published:2018-09 Issue: Volume: Page:
ISSN:
Container-title:2018 7th Electronic System-Integration Technology Conference (ESTC)
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Author:

Albrecht Bjoern,Alavi Golzar,Elsobky Mourad,Ferwana Saleh,Passlack Ulrike,Harendt Christine,Burghartz Joachim N.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8520538/8546331/08546380.pdf?arnumber=8546380

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Hybrid Systems in Foil: Merging the Best of Two Worlds;IEEE Electron Devices Magazine;2024-06

2. Security Enhanced Hybrid Electronic System in Foil for Temperature Sensing;2023 IEEE International Flexible Electronics Technology Conference (IFETC);2023-08-13

3. Flexible Ultrathin Chip-Film Patch for Electronic Component Integration and Encapsulation using Atomic Layer-Deposited Al₂O₃–TiO₂ Nanolaminates;ACS Applied Materials & Interfaces;2023-03-20

4. Processing and Chracterisation of an Ultra-thin Image Sensor Chip in flexible Foil System;2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS);2022-07-10

5. Integrating Ultra-thin SiGe BiCMOS Power Amplifier Chip in Combination with Flexible Antenna in the Polymer Foil;2022 IEEE International Symposium on Circuits and Systems (ISCAS);2022-05-28

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