Flexible Ultrathin Chip-Film Patch for Electronic Component Integration and Encapsulation using Atomic Layer-Deposited Al2O3–TiO2 Nanolaminates-Reference-Cited by-同舟云学术

Flexible Ultrathin Chip-Film Patch for Electronic Component Integration and Encapsulation using Atomic Layer-Deposited Al₂O₃–TiO₂ Nanolaminates

Author:

Passlack Ulrike¹^ORCID,Simon Nicolai²³,Bucher Volker²^ORCID,Harendt Christine¹,Stieglitz Thomas³⁴,Burghartz Joachim N.¹⁵

Affiliation:

1. Institut für Mikroelektronik Stuttgart (IMS CHIPS), Stuttgart D-70569, Germany

2. Faculty Mechanical and Medical Engineering (MME), Institute for Microsystems Technology (iMST), Rottweil D-78628, Germany

3. Laboratory for Biomedical Microtechnology, Department of Microsystems Engineering-IMTEK, University of Freiburg, Freiburg D-79110, Germany

4. BrainLinks-Braintools//IMBIT, University of Freiburg, Freiburg D-79110, Germany

5. Institute for Nano- and Microelectronic Systems (INES), University of Stuttgart, Stuttgart D-70569, Germany

Funder

Bundesministerium f?r Bildung und Forschung

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

Reference43 articles.

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