Security Enhanced Hybrid Electronic System in Foil for Temperature Sensing-Reference-Cited by-同舟云学术

Security Enhanced Hybrid Electronic System in Foil for Temperature Sensing

Published:2023-08-13 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE International Flexible Electronics Technology Conference (IFETC)
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Author:

Scholz Alexander¹,Wolfer Tim²,Friedrich Martin³,Albrecht Björn⁴,Sauva Sophie¹,Kister Thomas⁵,Lay Makara⁵,Abdolinezhad Saeed⁶,Hadrich Wacime⁶,Alam Shawon¹,Dost Georg⁷,Harendt Christine⁴,Sikora Axel⁶,Kraus Tobias⁵,Aghassi-Hagmann Jasmin¹

Affiliation:

1. Institute of Nanotechnology (INT), Karlsruhe Institute of Technology (KIT),Eggenstein-Leopoldshafen,Germany

2. Center for Functional Printing Technologies (CFPT),Continental AG,Freiburg,Germany

3. Cyient GmbH,Duisburg,Germany

4. Institut für Mikroelektronik Stuttgart (IMS CHIPS),Stuttgart,Germany

5. INM Leibniz Institute for New Materials gGmbH,Saarbrücken,Germany

6. Offenburg University of Applied Sciences,Institute of Reliable Embedded Systems and Communication Electronics (ivESK),Offenburg,Germany

7. Polysecure GmbH,Freiburg,Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10254736/10254789/10254812.pdf?arnumber=10254812

Reference9 articles.

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3. Multi-Chip Patch in Low Stress Polymer Foils based on an Adaptive Layout for Flexible Sensor Systems

4. A Circuits and Systems Perspective of Organic/Printed Electronics: Review, Challenges, and Contemporary and Emerging Design Approaches

5. Printed Electronics (PE) As An enabling Technology To Realize Flexible Mass Customized Smart Applications