Simulation and Analysis for Capillarity Underfill Process in High Density FCBGA Packaging-Reference-Cited by-同舟云学术

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Simulation and Analysis for Capillarity Underfill Process in High Density FCBGA Packaging

Published:2022-09-13 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
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Author:

Liu Yunting¹,Xu Cheng²,Ma Rui³,Shi Binjie³,Su Meiying³,Wang Qidong³,Cao Liqiang³

Affiliation:

1. Research and Development Center National Center for Advanced Packaging Co., Ltd.,Beijing,China

2. Research and Development Center National Center for Advanced Packaging Co., Ltd.,Wuxi,China

3. System Packaging and Integration Technology Center Institute of Microelectronics of Chinese Academy of Sciences,Beijing,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9939139/9939378/09939460.pdf?arnumber=9939460

Reference15 articles.

1. Study on Bump Arrangement to Accelerate the Underfill Flow in Flip-Chip Packaging

2. CFD Simulation Analysis and Experimental Study of Capillary Underfill Flow in Heterogeneous Integration

3. Investigation of Characteristics of the Capillary-driven Underfill Flow

4. Prediction of filling time in capillary-driven underfill process through 3D numerical analysis

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Accurate numerical simulations of capillary underfill process for flip-chip packages;Engineering with Computers;2024-08-03

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