CFD Simulation Analysis and Experimental Study of Capillary Underfill Flow in Heterogeneous Integration-Reference-Cited by-同舟云学术

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CFD Simulation Analysis and Experimental Study of Capillary Underfill Flow in Heterogeneous Integration

Published:2021-06 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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Author:

Miyazawa Risa,Marushima Chinami,Aoki Toyohiro,Horibe Akihiro,Hisada Takashi

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501811.pdf?arnumber=9501811

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Capillary Underfill Flow Simulation as a Design Tool for Flow-Optimized Encapsulation in Heterogenous Integration;Micromachines;2023-09-30

2. Two-Phase Flow Simulation of Capillary Underfilling as a Design Tool for Heterogenous Integration;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17

3. Simulation and Analysis for Capillarity Underfill Process in High Density FCBGA Packaging;2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC);2022-09-13

4. Comparative Analysis of Flow Capability of Epoxy Molding Compound between Spiral Structure and Actual Mold by Mold Flow Simulation;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

5. Capillary Flow Analysis of Underfill in Flip-Chip Package;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

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