Accurate numerical simulations of capillary underfill process for flip-chip packages
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Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s00366-024-02022-x.pdf
Reference14 articles.
1. Chang CJ. (2008) Volume shrinkage characterization of underfill materials, master’s thesis, Department of Mechanical Engineering, National Cheng Kung University
2. Ho CY. (2009) Research on volume shrinkage behavior of liquid compound, master’s thesis, Department of Mechanical Engineering, National Cheng Kung University. https://doi.org/10.1142/S0219030302001623
3. Deng SS, Ho CY, Lee HH, Hwang SJ, Hwang DY (2011) Volume shrinkage characterization of underfill materials. IEEE Trans Compon Packag Manuf Technol 1(1):76–82. https://doi.org/10.1109/TCPMT.2010.2100950
4. Ng FC, Tung LH, Zawawi MH, Mukhtar MAFM, Abas MA, Abdullah MZ (2020) Effect of contact angle on meniscus evolution and contact line jump of underfill fluid flow in flip-chip encapsulation. CFD Lett 12(6):28–38. https://doi.org/10.37934/cfdl.12.6.2838
5. Y. Liu et al. (2022) Simulation and analysis for capillarity underfill process in high density FCBGA packaging. In: 2022 IEEE 9th electronics system-integration technology conference (ESTC). https://doi.org/10.1109/ESTC55720.2022.9939460
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