Effect of Contact Angle on Meniscus Evolution and Contact Line Jump of Underfill Fluid Flow in Flip-Chip Encapsulation-Reference-Cited by-同舟云学术

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Effect of Contact Angle on Meniscus Evolution and Contact Line Jump of Underfill Fluid Flow in Flip-Chip Encapsulation

Published:2020-06-30 Issue:6 Volume:12 Page:28-38
ISSN:2180-1363
Container-title:CFD Letters
language:
Short-container-title:CFDL

Author:

Ng Fei Chong,Tung Lun Hao,Zawawi Mohd Hafiz,Muhamed Mukhtar Muhamed Abdul Fatah,Abas Mohamad Aizat,Abdullah Mohd Zulkifly

Publisher

Akademia Baru Publishing

Subject

Fluid Flow and Transfer Processes,Modeling and Simulation

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Accurate numerical simulations of capillary underfill process for flip-chip packages;Engineering with Computers;2024-08-03

2. No-flow underfill: Effect of chip placement speed on the void formation using numerical method;Microelectronics Journal;2021-08

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