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TEM-Like Launch Geometries and Simplified De-embedding for Accurate Through Silicon Via Characterization

  • Published:2017-04 Issue:4 Volume:66 Page:792-801
  • ISSN:0018-9456
  • Container-title:IEEE Transactions on Instrumentation and Measurement
  • language:
  • Short-container-title:IEEE Trans. Instrum. Meas.

Author:

de Paulis Francesco,Piersanti Stefano,Wang Qian,Cho Jonghyun,Erickson Nicholas,Achkir Brice,Fan Jun,Drewniak James,Orlandi Antonio

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Instrumentation

Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Combination Method for Impedance Extraction of SMD Electronic Components Based on Full-Wave Simulation and De-Embedding Technique;IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences;2024-08-01

2. High-frequency Transmission Characteristic Analysis of TSV-RDL Interconnects;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024

3. Miniaturization Strategy for Directional Couplers Based on Through-Silicon Via Insertion and Neuro-Transfer Function Modeling Method;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2023-11

4. Simulation Research on Parasitic Parameter Extraction of LDO Power Chip Package Based on ANSYS Q3D;2023 7th International Conference on Automation, Control and Robots (ICACR);2023-08-04

5. Generalized analytical formulation for de‐embedding of multiport devices based on known fixtures;International Journal of RF and Microwave Computer-Aided Engineering;2022-07-29
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