Simulation Research on Parasitic Parameter Extraction of LDO Power Chip Package Based on ANSYS Q3D

Author:

Xiao Yang1,Zhou Zhongyuan1,Wang Haichun1,Ren Jinjing1

Affiliation:

1. Southeast University,School of Mechanical Engineering,Nanjing,China

Publisher

IEEE

Reference18 articles.

1. Efficient PEEC Iterative Solver for Power Electronic Applications

2. Common-Mode EMI Noise Modeling and Reduction With Balance Technique for Three-Level Neutral Point Clamped Topology

3. Research on Parasitic Parameters of Electromagnetic Compatibility of Three-level Variable Frequency Speed Regulation System;he;M S thesis,2020

4. Model Order Reduction for Delayed PEEC Models With Guaranteed Accuracy and Observed Stability

5. High Frequency Model of Conducted EMI for PWM Variable-speed Drive Systems;meng;Proceedings of the CSEE,2008

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1. Package Model for DC-DC Converters Design;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07

2. Modeling and simulation research on conducted immunity of power module of digital control circuit based on transient EMI;IEICE Electronics Express;2024-03-25

3. Research on the Applicability of Multi-Source RF Radiation Field Strength Measurement Methods;2023 3rd International Conference on Electronic Information Engineering and Computer Communication (EIECC);2023-12-22

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