Miniaturization Strategy for Directional Couplers Based on Through-Silicon Via Insertion and Neuro-Transfer Function Modeling Method
Author:
Affiliation:
1. School of Microelectronics, Xidian University, Xi’an, China
Funder
National Natural Science Foundation of China
Cooperation Program of XDU-Chongqing IC Innovation Research Institute
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Software
Link
http://xplorestaging.ieee.org/ielx7/92/10287007/10239221.pdf?arnumber=10239221
Reference60 articles.
1. Device Characteristics of TSV-Based Piezoelectric Resonator With Load Capacitance and Static Capacitance Modification
2. A Comparison of Three Methods for Selecting Values of Input Variables in the Analysis of Output From a Computer Code
3. Power Delivery Design for 3-D ICs Using Different Through-Silicon Via (TSV) Technologies
4. On the Efficacy of Through-Silicon-Via Inductors
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