Monolithic 3D Integrated Circuits-Reference-Cited by-同舟云学术

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Monolithic 3D Integrated Circuits

Published:2007-04 Issue: Volume: Page:
ISSN:
Container-title:2007 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA)
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Author:

Wong Simon,El-Gamal Abbas,Griffin Peter,Nishi Yoshio,Pease Fabian,Plummer James

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4239457/4239458/04239491.pdf?arnumber=4239491

Cited by 30 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Fault Diagnosis for Resistive Random Access Memory and Monolithic Inter-Tier Vias in Monolithic 3-D Integration;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2024-07

2. Application of Pulsed Green Laser Activation to Top-Tier MOSFET Fabrication for Monolithic 3-D Integration;IEEE Transactions on Electron Devices;2024-01

3. Monolithic 3D integration of 2D materials-based electronics towards ultimate edge computing solutions;Nature Materials;2023-11-27

4. Investigation of the Electrical Coupling Effect for Monolithic 3-Dimensional Nonvolatile Memory Consisting of a Feedback Field-Effect Transistor Using TCAD;Micromachines;2023-09-23

5. Leveraging the Academic Artificial Intelligence Silecosystem to Advance the Community Oncology Enterprise;Journal of Clinical Medicine;2023-07-21

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