A New Adhesive for CoW Cu-Cu Hybrid Bonding with High Throughput and Room Temperature pre-Bonding-Reference-Cited by-同舟云学术

A New Adhesive for CoW Cu-Cu Hybrid Bonding with High Throughput and Room Temperature pre-Bonding

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Kayaba Yasuhisa¹,Nakamura Yuzo¹,Okada Wataru¹,Shikama Takuo¹,Tamura Kahori¹,Inada Satoshi¹

Affiliation:

1. Mitsui Chemicals, Inc.,Nagaura, Sodegaura,Japan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195272.pdf?arnumber=10195272

Reference14 articles.

1. An Advanced CuCu Hybrid Bonding For Novel Stacked CMOS Image Sensor

2. Wafer direct bonding: tailoring adhesion between brittle materials;ploèûl;Materials Science and Engineering,1999

3. Chip to Wafer Hybrid Bonding with Cu Interconnect: High Volume Manufacturing Process Compatibility Study

4. The role of diffusion phenomena in polymer-to-polymer adhesion

5. A study on multi-chip stacking process by novel dielectric polymer adhesive for Cu-Cu hybrid bonding;nakamura;2023 IEEE 73th Electronic Components and Technology Conference (ECTC),0

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