A New Adhesive for CoW Cu-Cu Hybrid Bonding with High Throughput and Room Temperature pre-Bonding
Author:
Affiliation:
1. Mitsui Chemicals, Inc.,Nagaura, Sodegaura,Japan
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195272.pdf?arnumber=10195272
Reference14 articles.
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4. The role of diffusion phenomena in polymer-to-polymer adhesion
5. A study on multi-chip stacking process by novel dielectric polymer adhesive for Cu-Cu hybrid bonding;nakamura;2023 IEEE 73th Electronic Components and Technology Conference (ECTC),0
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