Maskless Lithography for High-Density Package Redistribution Layers
Author:
Affiliation:
1. 3D Systems Packaging Research Center Georgia Institute of Technology,Atlanta,USA
2. Pennsylvania State University,3D Systems Packaging Research Center & Dept. of Electrical Engineering
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195577.pdf?arnumber=10195577
Reference7 articles.
1. Advances in High Performance RDL Technologies for Enabling IO Density of 500 IOs/mm/layer and 8-μm IO Pitch Using Low-k Dielectrics
2. Maskless lithography
3. Large area interposer lithography
4. Lithographic performance of a new generation i-line optical system: a comparative analysis
5. Deca & ASE Scaling M-Series & Adaptive Patterning to 600mm
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