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Deca & ASE Scaling M-Series & Adaptive Patterning to 600mm

  • Published:2021-12-07 Issue: Volume: Page:
  • ISSN:
  • Container-title:2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
  • language:
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Author:

Sandstrom Clifford,Olson Timothy,Fang Steve,Yang Jeffrey

Publisher

IEEE

Reference5 articles.

1. Adaptive Patterning for Panelized Packaging;scanlan;IWLPC Proceedings,2012

2. Adaptive Patterning Design Methodologies

3. Implementation of a fully molded fan-out packaging technology;rogers;IWLPC Proceedings,2013

Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Large Panel Fan-Out Process for High Performance Computing Device application with Micro Ball Mount Process;2024 International Conference on Electronics Packaging (ICEP);2024-04-17

2. Deca & ASE M-Series Bridge Die Compensation & Adaptive Patterning in a Multi-Die Module in 600 mm Format;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

3. TrueAdaptTM- AI Based Maskless Patterning to Compensate for Die-Shift in Fan-Out Wafer Level Packaging;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

4. Maskless Lithography for High-Density Package Redistribution Layers;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

5. Electroplating Uniformity Enhancement for High Performance Fan-Out Panel Level Packaging;2023 International Conference on Electronics Packaging (ICEP);2023-04-19
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