A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres-Reference-Cited by-同舟云学术

A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Nair Gourikutty Sajay Bhuvanendran¹,Long Lau Boon¹,Wei Seit Wen¹,Jong Ming Chinq¹,Wee Ho David Soon¹,Wu Jiaqi¹,Lim Teck Guan¹,Mandal Rathin¹,Choong Chong Ser¹,Yee Chia Lai¹,Li Xin²,Liow Jason Tsung-Yang²,Bhattacharya Surya¹

Affiliation:

1. Institute of Microelectronics, A*STAR (Agency for Science, Technology and Research),Innovis,Singapore,138634

2. Rain Tree Photonics Pte Ltd,D'Lithium,Singapore,368001

Funder

Agency for Science, Technology and Research

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195567.pdf?arnumber=10195567

Reference9 articles.

1. A Novel Packaging Platform for High-Performance Optical Engines in Hyperscale Data Center Applications

2. Towards Heterogeneous Integrated Electronic-Photonic Packages for Hyperscale Data Centers

3. A Review of Electronic-Photonic Heterogeneous Integration at DARPA

4. Progress in Low-Power Switched Optical Interconnects

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