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A Review of Electronic-Photonic Heterogeneous Integration at DARPA

  • Published:2016-11 Issue:6 Volume:22 Page:482-490
  • ISSN:1077-260X
  • Container-title:IEEE Journal of Selected Topics in Quantum Electronics
  • language:
  • Short-container-title:IEEE J. Select. Topics Quantum Electron.

Author:

Heidel Nicole DiLello,Usechak Nicholas G.,Dohrman Carl L.,Conway Josh A.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Atomic and Molecular Physics, and Optics

Cited by 15 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Compact Wafer-Level Heterogeneously Integrated Scalable Optical Transceiver for Data Centers;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. SiNx‐Based Digital–Analog Hybrid Resistive Random Access Memory via Heterogeneous Integration;physica status solidi (a);2024-04-11

3. Research on Modeling and IP Technology for High-Speed Optical Interconnection Interfaces in Optoelectronic Microsystems;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

4. A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

5. A Novel Packaging Platform for High-Performance Optical Engines in Hyperscale Data Center Applications;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
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