Inorganic capping layers in advanced photosensitive polymer based RDL processes: processing and reliability
Author:
Affiliation:
1. Imec,Leuven,Belgium
2. Veeco,Waltham,MA,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195367.pdf?arnumber=10195367
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3. Panel-Based Large-Scale RDL Interposer Fabricated Using 2-μm-Pitch Semi-Additive Process for Chiplet-Based Integration
4. Gas diffusion ultrabarriers on polymer substrates using Al2O3 atomic layer deposition and SiN plasma-enhanced chemical vapor deposition
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