Sustainable-Ink Process Recipes for the Fabrication of Additively Printed Circuits and Component Attachment-Reference-Cited by-同舟云学术

Sustainable-Ink Process Recipes for the Fabrication of Additively Printed Circuits and Component Attachment

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
language:
Short-container-title:

Author:

Lall Pradeep¹,Narangaparambil Jinesh¹,Soni Ved¹,Kulkarni Shriram¹,Goyal Kartik¹,Miller Scott²

Affiliation:

1. Auburn University,NSF-CAVE3 Electronics Research Center,Department of Mechanical Engineering,Auburn,AL,36849

2. NextFlex National Manufacturing Institute,San Jose,CA,95131

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195369.pdf?arnumber=10195369

Reference10 articles.

1. Performance of Component Interconnection Methods on Direct Write Additive Silver Circuits

2. Recent advances in isotropic conductive adhesives for electronics packaging applications;irfan;International Journal of Adhesion and Adhesives,2008

3. Printed Flexible LC Filter using the Micro-Dispensing Technique Using Silver Conductive Paste and ECA for Component Attachment;lall;ITHERM San Diego CA San Diego CA,2021

4. Low temperature sintering of Ag nanoparticles for flexible electronics packaging

5. Synthesis and Characterization of Silver Nanoparticles and Silver Inks: Review on the Past and Recent Technology Roadmaps

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Comparison of Sustainable and Non-Sustainable Ink Process-Performance Interactions for Additively Printed Circuits;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28