Impact of Dielectric and Copper Via Design on Wafer-to-Wafer Hybrid Bonding-Reference-Cited by-同舟云学术

Impact of Dielectric and Copper Via Design on Wafer-to-Wafer Hybrid Bonding

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Dubey Vikas¹,Wünsch Dirk¹,Gottfried Knut¹,Wiemer Maik¹,Fischer Tobias¹,Schermer Sebastian¹,Dittmar Nils¹,Helke Christian¹,Haase Micha¹,Ghosal Sanghamitra¹,Hanisch Anke¹,Bonitz Jens¹,Luo-Hofmann Jinji¹,Hofmann Lutz¹,Lykova Maria¹,Stoll Fiete¹,Vogel Klaus¹,Schulz Stefan E.¹

Affiliation:

1. Fraunhofer ENAS,Chemnitz,Germany,09111

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195353.pdf?arnumber=10195353

Reference9 articles.

1. Automatic Detection of Via Arrays in AFM Images for CMP Dishing Evaluation

2. 3D V-Cache: the Implementation of a Hybrid-Bonded 64MB Stacked Cache for a 7nm x86–64 CPU;wuu;Proc ISSCC San Francisco CA USA,2022

3. Automatic Analysis of CMP Dishing in Via Arrays from AFM Images;langer;International Conference on Planarization Technology Portland OR USA,2022

4. Wafer level packaging and direct interconnection technology based on hybrid bonding and through silicon vias;kühne;J Micromech Microeng,2011

5. Ultra-high bandwidth memory with 3D stacked emerging memory cells;abe;IEEE ICICDTT Grenoble France,2008

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