A Method to Improve 3D Interconnections Resource Utilization and Reliability in Hybrid Bonding Process Considering the Effects on Signal Integrity-Reference-Cited by-同舟云学术

A Method to Improve 3D Interconnections Resource Utilization and Reliability in Hybrid Bonding Process Considering the Effects on Signal Integrity

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Li Ang¹,Jiang Jianfei¹,Wang Qin¹,Jing Naifeng¹,Dong Zizheng¹,Ji Shuya¹,Cheng Xiulan¹,Zhao Yuhang¹

Affiliation:

1. School of Microelectronics, Shanghai Jiao Tong University,Shanghai,China

Funder

Shanghai Cadence Digital & Signoff, PE Team, China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195535.pdf?arnumber=10195535

Reference8 articles.

1. Inductance calculations; methods and equations

2. Self inductance of long conductor of rectangular cross section;piatek;Przeglad Elektrotechniczny,2012

3. Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness

4. Three-dimensional hybrid bonding integration challenges and solutions toward multi-wafer stacking

5. 184QPS/W 64Mb/mm23DLogic-to-DRAM hybrid bonding with process-near-memory engine for recommendation system;niu;IEEE International Solid-State Circuits Conference ISSCC 2022,0

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