A combined simulation and experimental study on cracking and delamination behavior at the Cu/Polyimide interface of RDLs in chiplet package subjected to thermo-mechanical loads-Reference-Cited by-同舟云学术

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A combined simulation and experimental study on cracking and delamination behavior at the Cu/Polyimide interface of RDLs in chiplet package subjected to thermo-mechanical loads

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
language:
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Author:

Chen Bin¹,Lyu Guang-Chao¹,Wang Hong-Guang¹,Zheng Long¹,Deng Yun-Kai¹,Zhang Xin-Ping¹

Affiliation:

1. School of Materials Science & Engineering, South China University of Technology,Guangdong Province Engineering Technology R&D Center of Electronic Packaging Materials & Reliability,Guangzhou,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195373.pdf?arnumber=10195373

Reference14 articles.

1. Analysis of the sandwich DCB specimen for debond characterization

2. A new data reduction scheme for mode I wood fracture characterization using the double cantilever beam test

3. Characterization of Face Sheet/Core Shear Fracture of Composite Sandwich Beams

4. Some issues in the application of cohesive zone models for metal–ceramic interfaces

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Semiconductor Fan-Out Polymer Adhesion on Physical Vapor Deposited Copper Coupling Temperature & Humidity Effects;2024 International Conference on Electronics Packaging (ICEP);2024-04-17

2. Delamination of Plasticized Devices in Dynamic Service Environments;Micromachines;2024-03-11

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