On the path to AI hardware via chiplet integration enabled by high density organic substrates-Reference-Cited by-同舟云学术

On the path to AI hardware via chiplet integration enabled by high density organic substrates

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Bonilla Griselda¹,Quinlan Brian²,Wassick Thomas²,Kastberg Russell²,Li Shidong²,Basutkar Monali²

Affiliation:

1. IBM Research, AI Hardware Research,Yorktown Heights,NY,USA

2. IBM Systems, Packaging Development,East Fishkill,NY,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195306.pdf?arnumber=10195306

Reference6 articles.

1. Differential heating/cooling chip joining method to prevent chip package interaction issue in large die with ultra low-k technology

2. bump electromigration reliability and comparison with high pb, SnPb, and SnAg bumps;syed;2011 IEEE 61st Electronic Components and Technology Conference (ECTC),0

3. Heterogeneous 2.5D integration on through silicon interposer

4. 3-D Die Stacking With 55 μm Pitch Interconnections on Advanced Ground-Rule Laminate for Artificial Intelligence System

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