On the path to AI hardware via chiplet integration enabled by high density organic substrates
Author:
Affiliation:
1. IBM Research, AI Hardware Research,Yorktown Heights,NY,USA
2. IBM Systems, Packaging Development,East Fishkill,NY,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195306.pdf?arnumber=10195306
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2. bump electromigration reliability and comparison with high pb, SnPb, and SnAg bumps;syed;2011 IEEE 61st Electronic Components and Technology Conference (ECTC),0
3. Heterogeneous 2.5D integration on through silicon interposer
4. 3-D Die Stacking With 55 μm Pitch Interconnections on Advanced Ground-Rule Laminate for Artificial Intelligence System
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1. システムインテグレーション実装技術の現状と展望(3Dチップレット集積のトレンドとこれから);Journal of The Japan Institute of Electronics Packaging;2024-01-01
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