Investigation of Cu-to-Cu and Oxide-to-Oxide Bonding-Reference-Cited by-同舟云学术

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Investigation of Cu-to-Cu and Oxide-to-Oxide Bonding

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Lee Sangmin¹,Oh Gwangsik¹,Choi Junyoung²,Kim Yoonho³,Park Sangwoo¹,Kim Sarah Eunkyung¹

Affiliation:

1. Seoul National University of science and Technology,Department of Semiconductor Engineering,Seoul,Korea

2. Seoul National University of science and Technology,Department of Electrical and Information Engineering,Seoul,Korea

3. AI Semiconductor Research Center, Seoul National University of science and Technology,Seoul,Korea

Funder

National Research Foundation of Korea

Korea Institute for Advancement of Technology

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195736.pdf?arnumber=10195736

Reference17 articles.

1. Low-Temperature Diffusion Behavior of Ti in Cu/Ti-Ti/Cu Bonding

2. The Effect of an Ag Nanofilm on Low-Temperature Cu/Ag-Ag/Cu Chip Bonding in Air

3. Anti-oxidant copper layer by remote mode N2 plasma for low temperature copper–copper bonding

4. Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient;juang;Sci Rep,2018

5. Demonstration of sub 150 °C Cu-Cu thermocompression bonding for 3D IC applications, utilizing an ultra-thin layer of Manganin alloy as an effective surface passivation layer

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. State of the Art of Cu–Cu Hybrid Bonding;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-03

2. Cu-Cu Hybrid Bonding;Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024

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