High-Performance Amplifier Package Design for Heterogenous Integration on Si-interposer-Reference-Cited by-同舟云学术

High-Performance Amplifier Package Design for Heterogenous Integration on Si-interposer

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Lim Teck Guan¹,Zho Lin¹,Tippabhotla Sasi Kumar¹,Lin Ji¹,Chinq Jong Ming¹,Wu JiaQi¹,Gongyue Tang¹,Ching Eva Wai Leong²,Ng Yong Chyn²,Chui King Jien²,Lu Wei Jia³,Goh Chee Heng³,Lin Pek Sek³,Loh Jun Wei Agnes³

Affiliation:

1. System-in-Package, Institute of Microelectronics, A *STAR (Agency for Science, Technology, and Research),Singapore

2. Heterogenous Integration, Institute of Microelectronics, A *STAR (Agency for Science, Technology, and Research),Singapore

3. DSO National Laboratories,Singapore

Funder

National Research Foundation, Singapore (NRF)

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195653.pdf?arnumber=10195653

Reference9 articles.

1. Thermal Challenges and Design Considerations in Heterogeneous Integrated Through-Silicon-interposer Platform for III-V HEMT Flip Chip

2. A 2.5D Heterogeneous Integration Demonstration for High Performance RF Application using High-Resistivity Through Si Interposer (TSI)

3. Nanoscale transport properties at silicon carbide interfaces

4. Metal-Embedded Chiplet Assembly for Microwave Integrated Circuits

5. Heterogeneous Integration of Microwave GaN Power Amplifiers With Si Matching Circuits

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