Thermal Challenges and Design Considerations in Heterogeneous Integrated Through-Silicon-interposer Platform for III-V HEMT Flip Chip
Author:
Affiliation:
1. A*STAR,System in Package, Institute of Microelectronics,Singapore
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816460.pdf?arnumber=9816460
Reference13 articles.
1. Silicon Interposer Package for MMIC Heterogeneous Integration Based on Gold/Solder Ball Flip-Chip Technique
2. Techniques to reduce thermal resistance in flip‐chip GaN‐based VCSELs
3. Entransy—A physical quantity describing heat transfer ability
4. Entransy concept and controversies: A critical perspective within elusive thermal landscape
5. Diamond-Incorporated Flip-Chip Integration for Thermal Management of GaN and Ultra-Wide Bandgap RF Power Amplifiers
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1. Reliability Evaluation of Board-Level Flip-Chip Package under Coupled Mechanical Compression and Thermal Cycling Test Conditions;Materials;2023-06-09
2. High-Performance Amplifier Package Design for Heterogenous Integration on Si-interposer;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
3. On the effect of partial underfilling on the fatigue life of flip-chip micro-solder bumps in a heterogeneously integrated TSI package using finite element simulations;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
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