CoWoS Architecture Evolution for Next Generation HPC on 2.5D System in Package
Author:
Affiliation:
1. Taiwan Semiconductor Manufacturing Company, Ltd,Hsinchu,Taiwan
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195565.pdf?arnumber=10195565
Reference9 articles.
1. Design and analysis oflogic-HBM2E power delivery system on CoWoS platform with deep trench capacitor;chen;Proc ECTC,2020
2. Integrated Deep Trench Capacitor in Si Interposer for CoWoS Heterogeneous Integration
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4. The next generation AMD Enterprise Server Product Architecture;lepak;IEEE Hot Chips Symposium,0
5. InFO (Wafe Level Integrated Fan-out) Technology;tseng;Proc ECTC,2014
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