Impact of Thermal Annealing and Other Process Parameters on Hybrid Bonding Performance for 3D Advanced Assembly Technology
Author:
Affiliation:
1. Intel Corporation,Chandler,Arizona,USA
2. Intel Corporation,Hillsboro,Oregon,USA
3. YES (Yield Engineering Systems),Fremont,California,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195571.pdf?arnumber=10195571
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