Prolongation of the Surface Activation Effect using Self-Assembled Monolayer for Low Temperature Bonding of Au-Reference-Cited by-同舟云学术

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Prolongation of the Surface Activation Effect using Self-Assembled Monolayer for Low Temperature Bonding of Au

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Takeuchi Kai¹,Kim Beomjoon²,Suga Tadatomo³

Affiliation:

1. the University of Tokyo,Collaborative Research Center, Meisei University System Design Lab,Tokyo,Japan

2. the University of Tokyo,Institute of Industrial Science,Tokyo,Japan

3. Meisei University,Collaborative Research Center,Tokyo,Japan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816483.pdf?arnumber=9816483

Reference16 articles.

1. Influence of air exposure time on bonding strength in Au-Au surface activated wafer bonding

2. Cu–Cu diffusion bonding enhancement at low temperature by surface passivation using self-assembled monolayer of alkane-thiol

3. Characteristics of Copper Nitride Nanolayer Used in 3D Cu Bonding Interconnects

4. Investigation of Surface Pre-Treatment Methods for Wafer-Level Cu-Cu Thermo-Compression Bonding

5. Effect of chain length on low temperature gold-gold bonding by self-assembled monolayers

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Room temperature bonding of Au assisted by self-assembled monolayer;Applied Physics Letters;2023-01-30

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